DL 360 Gen 11 server

Description

Overview 

HPE ProLiant DL360 Gen11

Do you need to effectively scale or update your IT infrastructure to drive your business forward? Compact 1U HPE ProLiant DL360 Gen11 adapts to different workloads and environments, delivering enhanced performance with the right balance between scalability and density. Designed for versatility and resiliency, the HPE ProLiant DL360 Gen11 comes with a comprehensive warranty, making it ideal for physical, virtual, or containerized IT infrastructures.

The HPE ProLiant DL360 Gen11 supports 4th and 5th Gen Intel® Xeon® Scalable processors (up to 64 cores) and 5600 MT/s HPE DDR5 Smart Memory with up to 4.0 TB per socket. The HPE ProLiant DL360 Gen11 introduces PCIe Gen5 and Intel ® Software Guard Extensions (SGX) support in the dual-socket segment, complementing the Gen10 Plus’ reach by providing premium compute, memory, network communications, discrete graphics, I/O, and security features. Customers focus on performance at all costs. DL360 Gen11 servers are an excellent choice for everyday business and workloads such as general-purpose computing, database management, virtual desktop infrastructure, content delivery networks, EDA, CAD, edge acceleration, and intelligent video analytics.

8 SFF Front View – 8 SFF + optional Universal Media Bay, optical drive, Display Port, USB2.0 and SAS drives shown

1.	Drive support label	8.	iLO Service port
2.	Serial number/iLO information pull tab	9.	Power On/Standby button and system power LED
3.	Quick removal access panel	10.	Health LED
4.	Universal Media Bay (optional):	11.	NIC status LED
· Option: Optical drive bay + Display port & USB 2.0 port kit (shown) · Option : 2SFF 24G x4 NVMe/SAS (TriMode) U.3 BC Cage		12.	Unit ID button/LED
		13.	USB 3.2 Gen1 port
		14.	Drive bays; optional backplanes:
5	Display Port (optional – shown)	Option: 8 SFF 24G x1 NVMe/SAS (TriMode) U.3 BC Option: 8 SFF 24G x4 NVMe/SAS (TriMode) U.3 BC
6	Optical drive (optional – shown)
7	USB2.0 port (optional)

Notes: Optional- Systems Insight Display (SID) module is available for 8SFF CTO Server, and will be installed at the left-hand side of iLO Service port and USB 3.2 Gen1 port.

 

 

4 LFF Front View – 4 LFF + optional Optical drive, Display Port, USB2.0 and SAS drives shown

1.	Drive support label	7	iLO Service Port
2.	Optical drive (optional – shown)	8.	Power On/Standby button and system power LED
3.	Serial number/iLO information pull tab	9.	Health LED
4.	Quick removal access panel	10.	NIC status LED
5.	Option: Display port & USB 2.0 port bundle Kit (blank shown)	11.	Unit ID button/LED
6.	USB 3.2 Gen1 port	12.	SAS/SATA drive bays (12G x1 SAS LP BP embedded)

Notes: The optional Systems Insight Display (SID) module is not available in 4LFF CTO Server.

 

20 EDSFF Front View – 20 E3.s 1T NVMe drives shown

1.	Drive support label	6.	Health LED
2.	Serial number/iLO information pull tab	7.	NIC status LED
3.	Quick removal access panel	8.	Unit ID button/LED
4.	iLO Service Port	9.	USB 3.2 Gen1 port
5.	Power On/Standby button and system power LED	10.	EDSFF drive bays (32G x4 NVMe BP embedded)

Notes: The optional Systems Insight Display (SID) module is not available in 20EDSFF CTO Server.

 

Internal View – Standard for all DL360 Gen11

1.	Liquid Cooling Module connector	13.	System Battry
2.	x8 SlimSAS ports (1A to 4A, 1B to 4B)	14.	Primary (CPU1) Riser PCIe 5.0
3.	DDR5 DIMM Slots (fully populated 32 DIMMs shown)	· 1x 16 FH and 1×16 LP slots
4.	Socket 2 MCIO ports (1 & 2)	15.	OCP Slot port
5.	Backplane Power connector	16.	Front Display Port and USB 2.0 connector (optional feature)
6.	Internal USB port (top USB 3.2 Gen1 and bottom USB 2.0)	17.	LP SlimSAS ports (1 & 2)
7.	Redudant Power Supply (1 & 2 as shown)	18.	Chipset
8.	Secondary (CPU 2) Riser PCIe 5.0	19.	Front I/O and USB 3.2 Gen1 connector
· Option: Low Profile x16 · Option: Full height x16 (lose Slot 2 on Primary Riser)		20.	SATA Optical port
		21.	Socket 1 MCIO connector
9.	SID connector (optional feature, 8SFF only)	22.	CPU 1 (bottom) and CPU 2 (top) (shown with High Performance Heatsink)
10.	Energy Pack connector	23.	Hot plug (dual rotor) High Performance Fan Kit (7 fans)
11.	OCP Slot port	· Option: Closed-loop Liquid Cooling Heat Sink Fan FIO Bundle Kit
12.	HPE NS204i-u NVMe Hot Plug Boot Optimized Storage Device (optional – shown)	24.	HPE Hybrid Capacitor or HPE Storage Battery holder

 

Rear View – Standard for all DL360 Gen11

1.	Slot 1 x16 PCIe 5.0 – Full Height	6.	OCP 3.0 Slot 2: x16* PCIe 5.01,2 (Requires 2nd Processor)  Notes: *x8 for 20EDSFF CTO Server (requires 2nd Processor)
2.	Slot 2 x16 PCIe 5.0 – Low Profile* Notes: *Shown with optional hot-plug NS204i-u Boot Device (cabled, PCIe connection is not required)	7.	Serial port (optional –  shown)
3.	Option: Slot 3 x16 PCIe 5.0 (Requires 2nd processor)	8.	iLO Management Port
Low Profile and Full Height options		9.	USB 3.2 Gen1 Ports
4.	Redundant Power Supply (1 & 2 as shown)	10.	Uint ID Indicator LED
5.	Video (VGA) port	11.	OCP 3.0 Slot 1: x16* PCIe 5.02 Notes: *x8 for 20EDSFF CTO Server

Notes:

– ¹ Supports various NICs, up to 200GbE

– ² Or supports each slot with x8 PCIe 5.0 under one processor, with the selection of “P51911-B21, CPU1 to the “OCP2 x8 Enablement Kit”.

 

 

Form Factor

• 1U  rack

Chassis Types

• 20 EDSFF Carrier 1T (EC1) drive bays: 32G x4 NVMe (PCIe5.0 E3.s 1T)

 

• 8 SFF Basic Carrier (BC) drive bays:

– 24G x1 NVMe/SAS (TriMode) U.3 (PCIe4.0) or

– 24G x4 NVMe/SAS (TriMode) U.3 (PCIe4.0)

• With options for additional 2 SFF BC drive bays: 24G x4 NVMe/SAS (TriMode) U.3 (PCIe4.0)

 

• With options for additional optical drive, 1x USB3.2 Gen1 and 1x Display Port

 

• 4 LFF Low Profile (LP)drive bays: 12G x1 SAS/SATA

 

• With additional options for optical drive, 1x USB3.2 Gen1, and 1x Display Port

 

System Fans

• For 4 LFF and 8+2 SFF chassis

– Choice of 1P (one processor) Standard Fan Kit, 2P (two processors) Standard Fan Kit, Performnace Fan Kits and Closed-loop Liquid Cooling Heatsink Fan FIO Bundle Kit

• For 20 EDSFF chassis

– Choice of Performance Fan Kits and Closed-loop Liquid Cooling Heatsink Fan FIO Bundle Kit

Notes:

– Standard Fan Kit: Dual rotor hot plug Standard Fan kit (includes 5 fans) for processors below 185W TDP.

– Optional 2P standard Fan Kit: Dual rotor hot plug 2P Standard Fan Kit (includes 2 fans) for second processor.

– Performance Fan Kit: Dual rotor hot plug High Performance Fan Kit available (includes 7 fans), for one or two processors from 186W to 270W TDP. Or one processor with 300W TDP.

– The DL360 Gen11 will support up to 7 fans with fan redundancy built in. One fan rotor failure will place server in degraded mode but fully functional. Two fan rotor failures could provide warning and imminent server shutdown.

– Closed-loop Liquid Cooling Heat Sink Fan FIO Bundle Kit supports one or two processors that go beyond 271W TDP, as factory installation kit only. Customer self-repair or self-field upgrade is not allowed.

– Direct Liquid Cooling Heatsink Fan FIO Bundle Kit supports two processors go beyond 271W TDP, with enhanced thermal condition

 

Dimensions  (Height x Width x Depth)

SFF Drives

• 4.29 x 43.46 x 75.31 cm
• 1.69 x 17.11 x 29.65 in

LFF Drives

• 4.29 x 43.46 x 77.31 cm
• 1.69 x 17.11 x 30.43 in

EDSFF Drives

• 4.29 x 43.46 x 77.31 cm
• 1.69 x 17.11 x 30.43 in

Weight (approximate)

• 14.56 kg (32.1 lb)

– SFF minimum: One drive, one processor, one power supply, two heatsinks, one Smart Array controller, and five fans.

 

• 20.44 kg (45.07 lb)

– SFF maximum: Ten drives, two processors, two power supplies, two heatsinks, one Smart Array controller and seven fans.

 

• 14.95 kg (32.96 lb)

– LFF minimum: One drive, one processor, one power supply, two heatsinks, one Smart Array controller and five fans.

 

• 21.58 kg (47.58 lb)

– LFF maximum: Four drives, two processors, two power supplies, two heatsinks, one Smart Array controller and seven fans.

 

• 14.75kg (32.51lb)

– EDSFF minimum: One drive, two processors, one power supply, two heatsinks, one Smart Array controller, and seven fans.

 

• 21.19kg (46.71lb)

– EDSFF maximum:  Twenty drives, two processors, two power supplies, two heatsinks, one Smart Array controller and seven fans.

 

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Configuration Information

CTO Server HPE DL360 Gen11 4LFF NC CTO Server HPE DL360 Gen11 8SFF NC CTO Server HPE DL360 Gen11 20EDSFF NC CTO Server SKU Number P52498-B21 P52499-B21 P52500-B21 TAA SKU* P52498-B21#GTA P52499-B21#GTA P52500-B21#GTA HPE Trusted Supply Chain Optional: HPE Trusted Supply Chain for HPE ProLiant (P36394-B21) Processor Not included as standard. Optional: Qty 1 or 2 (2 processors must be selected in 20EDSFF NC CTO Server) DIMM Slots 32-DIMM slots DIMM Blanks DIMM Blanks are required, embedded and shipped as default in all CTO Servers Storage Controller Choice of Intel® VROC Software RAID capable; Choice of HPE ProLiant external hardware controller Choice of HPE ProLiant Gen11 MR and SR PCIe and OCP plug-in Controller,   Choice of Intel® VROC Software RAID capable Choice of HPE ProLiant external hardware controller **Internal Hardware Controller support is not available   PCIe Slots Up to 3 Slots PCIe 5.0 (Slot 1, 2 &3) One standard primary/butterfly riser: 2 slots as Slot 1 & Slot 2 (1 x16 FH / 1 x16 LP) and 4 x8 front NVMe connectors Optional:  Slot 3 in 1 x16 FH or LP slot All PCIe Slos are in design with up to 9.5″ length OCP3.0 Slots PCIe 5.0: 2 slots (1×16/ 1×16) 1 PCIe 5.0: 2 slots (1×8/ 1×8) 2

Drive Cage – included 4 LFF – default backplane. 12G x1 SAS with Low Profile (LP) carrier support. 8SFF – Optional backplanes. in choice of: – 24G x1 NVMe/SAS U.3, or – 24G x4 NVMe/SAS U.3, TriMode supported, must be selected if internal drives needed. Basic carrier (BC) support. (PCIe4.0 storage) 20EDSFF – default backplane. 32G x4 NVMe, with E3.s 1T carrier (EC1) support. (PCIe5.0 storage)   Network Controller “BCM 5719 1Gb 4p BASE-T OCP Adptr” to be defaulted in the configurator at OCP Slot 21. Customer is allowed to remove and select other cards (PCIe of OCP) from Networking, InfiniBand, Smart IO (HW) or Storage Offload category.   Choice of OCP3.0 or stand-up cards for primary networking selection plus additional/optional stand-up networking adapters.   Notes: – No embedded networking from motherboard. – 1In 1 Processor configuration, “CPU1 to OCP2 x8 Enablement Kit” will be selected as default as OCP NIC is pre-selected at OCP Slot 2, to be defaulted in the configurator if 1 Processor is selected. Customer is allowed to remove if OCP NIC is not selected but need to be replaced by a PCIe standup NIC. Meanwhile, the “CPU1 to OCP2 x8 Enablement Kit” will be removed. – 1“CPU2 to OCP2 x8 Enablement Kit” or “CPU2 to OCP2 x16 Enablement Kit” must be selected if OCP NIC is selected in 2 Processors configuration. – “CPU2 to OCP2 x8 Enablement Kit” to be defaulted in the configurator if 2 Processors are selected. User should be allowed to remove “CPU2 to OCP2 x8 Enablement Kit” and should be forced select “CPU2 to OCP2 x16 Enablement Kit” if OCP NIC is selected. Customer is allowed to remove if OCP NIC is not selected but need to be replaced by a PCIe standup NIC. Meanwhile, the “CPU2 to OCP2 x8 Enablement Kit” will be removed. – 2 In 20EDSFF CTO model, either no OCP enabmenet kit or “CPU2 to OCP2 x8 Enablement Kit” can be selected from the limied PCIe5.0 electrical lanes from OCP Slot 1 (x8) and OCP Slot2 (x8). Fans Choice of · 5 Standard Fans for one processor below 185W TDP · Additional 2 Standard Fans for 2nd Processor below 185W TDP · 7 High Performance Fan for processors 186W – 270W TDP · 7 High Performance Fan for processors 300W TDP in one socket configuration · Closed-loop Liquid Cooling (CL LC) Heat Sink Fan Bundle FIO Kit (7 fans included) for one or two processors above 271W TDP · Direct Liquid Cooling (DLC) Heatsink and High-Performance Fan FIO solution, for all processors in 2P Configuration Notes: If Closed-loop Liquid Cooling HeatSink Fan FIO Bundle Kit is selected, there is default a FAN Kit bundled. Then any Fans (Standard Fan Kit or High Performane Fan Kit) cannot be selected. In the CL LC bundle Kit, with full speed the Fan Kit runs at 210W, which requires 42W additional power than DL360 Gen11 Performance Fan Kit. Management HPE iLO with Intelligent Provisioning (standard) HPE GreenLake for Compute Ops Management (a 3-year subscription included) Optional: iLO Advanced and OneView Video Output Rear: 1 VGA Optional: · 1 Front Display Port (standalone in 8SFF; USB2.0+ Display Port bundle kit in 4LFF), · 1 Rear Serial Port USB Front: 1 USB 3.2 Gen1 + iLO service port Rear: 2 USB 3.2 Gen1 Internal: 1 USB 3.2 Gen1 + 1 USB2.0 Optional: 1 Front USB 2.0 Security Trusted Platform Module (TPM) 2.0. It is an embedded feature and can be disabled in the BIOS setting. Notes: Disabled for shipments to China Rail Kit Optional Easy Install rails and CMA · HPE Easy Install Rail 3 Kit (P52341-B21) is available for 8SFF CTO Server if Rack is selected · HPE Easy Install Rail 5 Kit (P52343-B21) is available for 4LFF & 20EDSFF CTO Server if Rail kit is selected · DL300 Gen10 Plus 1U CMA (P26489-B21) as optional. (If CMA is selected, then Rail Kit must be selected) Notes: Server does not support shelf mounted rail kits (“L” brackets). Form Factor 1U Rack Warranty 3-year parts, 3-year labor, 3-year onsite support with next business day response.